| Prototype Mass | Production | ||
Board Thickness |
Double sided Multi-layer/FlexiRigid/ Aluminum |
0.15mm-2.4mm 0.4mm-3.2mm (6.0mm on special request) |
0.15mm-2.4mm 0.4mm-3.2mm (6.0mm on special request) |
Layer counts |
Up to 30 Layers | Up to 30 Layers | |
Design Range (Min. Line width/spacing) |
Inner Layer Outer Layer Warpage Tolerance |
0.003"/0.003" 0.003"/0.003" 0.7% max |
0.003"/0.003" 0.003"/0.003" 0.7% max |
Planted Thru Hole |
Min Diameter | 0.0078" | 0.0078" |
Max. Size of PC Board |
24x18" | 24x18" | |
Product Finishing |
Hasl Hasl(Lead Free) Flash Gold Palladium Gold Immersion Gold Immersion Silver Immersion Tin Palladium Gold Carbon Print Gold Fingers Entek CU106A Peelable Mask |
Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes |
Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes |
Delivery Lead Time |
7-20 days | 3-5 weeks | |
Double Side: Copper Weight |
11oz | 11oz | |
Multilayer: Copper Weight (inner) (outer) |
6oz 13oz |
6oz 13oz |
|
Line Width Spacing 1-3 oz (outer) Line Width Spacing 1-2 oz (inner) |
0.10mm 0.15mm |
0.15mm-0.25mm 0.20mm |
|
Layer to Layer Registration |
0.003 " | 0.004 " | |
Solder Mask |
Green, Blue, Red, White, Black | Green, Blue, Red, White, Black | |
Laminate types (RoHS) |
FR4,Tg170,Tg210, Flexi-Rigid, Aluminum | FR4,Tg170,Tg210, Flexi-Rigid, Aluminum | |
Blind Via/Buried Via |
 0.0078" |
0.0078" |
|
Via hole |
Blind/Buried via | 0.25 0.20mm |
0.25 0.20mm |
Impedance Control |
(50)+/-5% | (50)+/-5% | |
Capacity |
300,000 sq.ft (month) | ||
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